Alumina (Al2O3) ceramic substrate crystal

Alumina (Al2O3) Ceramic Substrate
Description: Ceramic substrate, also known as ceramic substrate, is a sheet-like material based on electronic ceramics that forms a supporting base for membrane circuit components and external bonding components. Ceramic substrate has the main advantages of high temperature resistance, high electrical insulation, low dielectric constant and dielectric loss, large thermal conductivity, good chemical stability, and thermal expansion coefficient similar to that of the component. However, the ceramic substrate is relatively brittle and made The substrate area is small and the cost is high.
The actual production, development and application of ceramic substrate materials include Al2O3, AlN, SiC, BeO, BN, zirconia and glass ceramics. Although the thermal conductivity of Al2O3 ceramic substrate is not high (20W/mK), because of its relatively simple production process, low cost and low price, it has become the most widely used ceramic substrate at present.
Generally, aluminum oxide is prepared by casting method. Ceramic substrate, 96% alumina ceramic substrate material is added with suitable mineral raw materials as a flux. The firing temperature is as low as 1580℃~1600℃, and the product density can reach more than 3.75g/cm3. For products with high dimensional accuracy requirements, after firing, laser processing methods can be used to scribe and punch holes on the substrate with an accuracy of ±0.05mm.
　　The ceramic substrate provided by our company is made of alumina ceramic substrate by casting method. The product has the advantages of good thermal conductivity, stable insulation, thermal shock resistance, wear resistance and acid and alkali resistance. It can be used for thick film hybrid integrated circuits HTC, LED Ceramic cooling bases, power modules, semiconductor devices and other fields.
96% alumina ceramic substrate
1) Thick film circuit substrates: The company’s thick film hybrid integrated circuit substrates are used on thick film hybrid integrated circuits (HIC), which are mainly used for automotive and communication thick film circuits (communication, automotive) ).
2) Die stamping sheet: Our company can produce various specifications of mold substrates according to customer requirements, which are mainly used for substrates for crystal oscillators, substrates for potentiometers, substrates for refrigerators, various special-shaped substrates, military and medical substrates, etc.
3) Laser perforated sheet: Various specifications of laser perforated products can be produced according to customer requirements to meet customer design requirements for perforated components.
4) Substrates for printers and semiconductor equipment: These products are mainly used in printers and semiconductor equipment. At present, the largest printer substrate that our company can provide is 380mm*100mm, and the thickness is any thickness between 0.38-1.2.
The 99% alumina ceramic substrate has better wear resistance than the commonly used 96 alumina ceramic material, insulation at room temperature and high temperature, thermal shock resistance, and chemical resistance. The thermal conductivity of 99 porcelain is about 28W/m·K, which is higher than 96 porcelain, which can be used as a high-performance heat dissipation substrate.

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