In the era of intelligence
For example, with the support of system-in-package (SiP) technology, the RF circuit area of 5G mobile phones is smaller, but it supports more frequency bands. Radio frequency front-end ( RF FE), low-power Bluetooth , WiFi, radar (Radar), sensor (Sens or ), power management chip ( PMIC ), storage (Memory) and other semiconductor devices are used in smartphones , 5G communications, industry , and intelligence It has been widely used in transportation and other fields, in which SiP technology plays an indispensable role.
With the breakthrough and mass production of Chiplet packaging and testing technology, heterogeneous SiP technology has accelerated its penetration into the field of SoC development.
Changdian Technology has carried out technical cooperation with many customers in the field of high-density SiP. It has a complete SiP technology platform and rich product mass production experience for different downstream applications. It can create customized smart devices for customers based on different terminal application scenarios. Terminal SiP packaging and testing solutions provide turnkey services from packaging collaborative design, simulation , manufacturing to testing.
Changdian Technology has the industry's leading SiP technology platform, which has significant advantages such as high-density integration and high product yield.
The double-sided SiP technology launched by Changdian Technology further reduces the area of the device by 40% compared to single-sided SiP, shortens the signal transmission path and reduces material costs.
Changdian Technology can also flexibly use conformal and split-cavity shielding technologies to effectively improve the EMI performance of packaged modules.
Relying on the high-density system-level packaging SiP technology laid out in advance, Changdian Technology has cooperated with multiple customers to complete the development and mass production of multiple 5G radio frequency modules, and has been highly recognized by customers and the market.
At the same time, SiP packaging technology is rapidly penetrating into smart wearables, smart homes , industrial automation and large computing power systems. Changdian Technology will continue to launch SiP chip manufacturing, packaging and testing solutions corresponding to applications to help customers achieve higher performance and faster processing speed, while significantly reducing the space requirements inside electronic devices, creating greater added value for customers.
[The above information is compiled and released by Aibo Testing. If there is any discrepancy, please correct it in time. If there is any reference, please indicate the source. Welcome to discuss together. We have been paying attention to its development! Focus: CCC/SRRC/CTA/operator warehousing]