[Industry Internet Weekly] A number of major IT companies in Silicon Valley formed a modern computing alliance to provide enterprise cloud services; TSMC’s new packaging technology will be put into production in 2023...

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[ Industrial Internet Weekly Report is a featured product released by Titanium Media TMTpost, which will integrate the most important enterprise-level services, cloud computing, and cutting-edge trends in the field of big data , heavy policies and industry research reports this week .

This week (December 7th to December 13th) Google, Dell, Intel and many other mainstream technology companies in the IT and cloud computing industries have teamed up to solve security, remote office and other enterprise service issues. The alliance of these companies is called the "Modern Computing Alliance" and its founding members also include Box, Cirtrix, Imprivata, Okta, RingCentral, Slack, VMWare and Zoom.

A number of major IT companies in Silicon Valley formed a modern computing alliance to provide enterprise cloud services

On December 11, according to The Verge, a number of mainstream technology companies in the IT and cloud computing industries, including Google, Dell, and Intel, have joined forces to form the Modern Computing Alliance. According to reports, the multi-party cooperation aims to jointly solve security, remote office and other enterprise service issues.

The alliance will first focus on the four areas of performance, security and identity authentication, productivity collaboration, and healthcare, and solve the problems of how companies use cloud work and the use of related tools.

In the future, the Modern Computing Alliance will bring in as many IT professionals as possible to assist in the establishment of an expert committee that can identify problems and find solutions, and plans to share specific action plans in the first half of 2021.

117 major projects in Anhui started concentratedly, with a total investment of over 90 billion yuan

On December 12, Anhui accelerated the implementation of digital economy empowerment and the province's thirteenth batch of major projects to implement the "six stability" on-site promotion meeting was held in Jin'an Economic Development Zone, Lu'an City, with a total of 117 key projects. The newly started projects include Beidou radar, ground terminal, road robot and other high-tech industry projects. The total investment of the project amounts to 90.15 billion yuan.

The Institute of Information and Communications Technology, together with Tencent Cloud and Huawei, released the IoT industry standard model platform

On December 11, Tencent Cloud officially released and launched a standard object model platform for the Internet of Things industry at the IoT Ecological Summit.

The standard object model platform released this time is led by the Intelligent IoT Ad Hoc Group of the Industrial Internet Alliance, led by the Institute of Information and Communications Technology, Tencent, and Huawei. The standard object model library has the advantages of standard disclosure, cost control, resource openness, and rich categories. It can be used as a general standard in the Internet of Things field in various scenarios in the entire industry, and can also be used for the interconnection of the Internet of Things industry, the establishment of industry standards, and Provide support for industrial ecological development.

For members of the Industrial Internet Industry Alliance, the standard object model platform can define a unified information exchange format that can be used between different objects through the standardization of model information, and realize the standardized expression of all elements and the entire industry chain in the information space, allowing the alliance All kinds of IoT devices of members can quickly realize data interconnection, and realize the co-creation and sharing of alliance members.

At present, the standard object model library produced through this platform has achieved data interoperability on multiple platforms such as Tencent Cloud IoT platform and Huawei Cloud IoT platform. The standard object model library, grammar rules, industry best practices, and solution scenarios have been implemented. It has also realized openness to the whole society. Enterprise users can not only directly submit various industry models on the material model website to achieve rapid multi-platform application, but also use the platform's free management tools to quickly connect devices and low-cost application construction.

Google announced the acquisition of Actifio, which will be merged into Google Cloud

According to TechCrunch, on December 4, Google announced that it would acquire Actifio, a data management and disaster recovery provider company. After the acquisition, Actifio will be merged into Google Cloud. The terms of the transaction have not yet been disclosed.

Actifio was established in 2009 to provide long-term data storage, backup and recovery services for enterprise users.

It is worth noting that when the company was valued at more than $1 billion in a round of financing in 2014, it had stated that it was preparing for an IPO (not yet listed). It is reported that Actifio was valued at US$1.3 billion in 2018. At the beginning of this year, the company seemed to be raising funds at a price 60% lower than its recent valuation. It has raised about US$461 million. Investors include Andreessen Horowitz, TCV, Tiger , 83 North etc. In addition, the company filed a patent infringement lawsuit against Rubrik earlier this year.

China-made car-grade AI chip Horizon Journey 2nd generation shipment reaches 100,000

At the beginning of December, Horizon announced that the shipment of Horizon Journey 2, a car-level artificial intelligence chip, has exceeded 100,000. Cars equipped with this chip have achieved L2+ level autonomous driving. According to Titanium Media App, it is expected to ship 150,000 pieces in 2020, far exceeding industry expectations.

TSMC's new packaging technology will be put into production in 2023

In early December, according to industry chain sources, TSMC’s sixth-generation CoWoS chip packaging technology will be put into mass production in 2023.

The news about TSMC’s full-scale entry into the construction of a packaging and testing plant may not be groundless. Taiwan’s Miaoli County Mayor Xu Yaochang stated on Facebook before that TSMC has decided to invest in an advanced packaging and testing plant located in Zhunan Town, Miaoli County. Xu Yaochang said that the north side street profile of the packaging and testing plant is expected to be completed in May 2021. The first phase of the plant will be operational in 2021, and it is initially expected to provide 1,000 jobs. The packaging and testing plant is expected to have a total investment of approximately NT$303.2 billion (approximately RMB 72.2 billion), which is the largest single investment in Taiwan’s history.

It is reported that the purpose of building the packaging and testing plant is to help TSMC enter high-end IC packaging and testing services to provide one-stop services with advanced 3D packaging and testing technology.

Tencent Security Releases Ten Trends of Industrial Internet Security in 2021

According to news on December 11, Tencent’s Security Strategy Research Department and Tencent’s Security Joint Laboratory have jointly released the "Ten Trends in Industrial Internet Security (2021)", based on industry practices and industry trends in 2020, from policies, regulations, and security technologies. The dimensions of, security concept, security ecology, and security thinking provide forward-looking reference and guidance for the security construction of the industrial Internet, and help consolidate the security foundation of the industrial Internet.

The ten major trends are: 1) The intensive release of laws and regulations accelerates the improvement of the personal information protection system; 2) The global digital security co-governance system is imperative; 3) The evolution of privacy computing from technical verification to pilot applications; 4) Zero trust architecture Into the application promotion period; 5) AI reshapes network security attack and defense; 6) Cloud-native security to build the optimal solution for the security service system; 7) 5G security will pay more attention to systematization and scenarioization; 8) Multi-linked black and gray production governance The system is gradually taking shape; 9) Supply chain security risks force the establishment of a “community” for upstream and downstream security protection; 10) Security front has become a prerequisite for industrial digital transformation.

"China Telecom Terminal Insight Report 2020 Edition"

China Telecom Mobile Terminal Research and Test Center released the 2020 version of the terminal insight report. The report focuses on 5G, AI, pan-terminals and other fields, including full Netcom terminal big data report, full Netcom terminal consumption trend report, 5G full Netcom terminal communication performance evaluation report, AI chip evaluation report, AI application experience evaluation, and smart home terminal consumption trends Seven major reports, including the report and the evaluation report of Zhijia router chip, shared the key findings of research from the perspective of consumers and channels.

The report puts forward four key findings: First, the stability and endurance of 5G mobile phones have been greatly improved; second, the 5G perception rate of 5G mobile phone consumers has increased significantly; third, the overall net recommendation value of terminals has increased; fourth, the rapid rise of pan-terminal consumption, consumption The number of pan-smart terminals owned by the family has reached 2.5. The report also called for the industry to pay more attention to the improvement of energy efficiency while improving the computing power of AI chips.

The "Public Survey Report on Face Recognition Applications (2020)" shows that 60% of the respondents believe that face recognition technology has a tendency to abuse

In the "Public Research Report on Facial Recognition Applications (2020)", 30% of the respondents said that they have suffered privacy or property losses due to the leakage and abuse of facial information.

Face recognition also has a prominent "mandatory use" problem. The "Report" found that in the "traffic security check" scene, the respondents who encountered mandatory face recognition were the most, reaching 27.39%, followed by "real name registration" (26.42%), "account opening and cancellation" (25.94%), and "payment and transfer". (25.81%) "Access Control Time Attendance" (21.76%).

It needs to be emphasized that although the interviewees still have concerns about face recognition technology, their attitudes are generally positive. More than 60% (65.24%) of the respondents believe that face recognition "overall benefits outweigh the disadvantages, and risks should still be paid attention to when promoting applications to protect users' right to know and choose".

The "Report" pointed out that face information, as the most sensitive type of "personal biometric information" in personal information, should be the focus of attention and protection. To further guide the application of face recognition technology by means of legislation, regulations, standards, etc., will be a wise move to effectively protect the legitimate rights and interests of citizens.

Over 50,000 companies have entered the semiconductor industry this year

The latest data released by S&P Global Market Intelligence shows that since the beginning of this year, Chinese semiconductor companies have raised nearly US$38 billion (approximately RMB 248.9 billion) through public offerings, private placements, and asset sales. The total amount of funds raised more than doubled.

According to data from the China Semiconductor Industry Association (CSIA), there are currently more than 1,600 local semiconductor companies in my country, and their share of the global market has risen to 13%, while 10 years ago, this number was only 5%. In addition to local semiconductor companies, more and more companies are engaged in semiconductor-related businesses. According to the data compiled by the company registration and tracking agency, since this year, more than 50,000 domestic companies whose main business is not related to semiconductors are playing "cross-border" and are involved in semiconductor-related businesses through registration.

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